How To Reflow Solder

A real reflow oven.

How to reflow solder. The reflow soldering technique resembles the traditional soldering process in many ways. You can also use reflow ovens to solder through-hole components simply by filling the through-hole holes with solder paste and inserting the component leads through the paste. A maximum ramp rate from ambient to peak of 1-15Csecond is recommended.

For the first step the deposit of solder paste you need a silkscreen. Once that is done simply place your emitter on the board over the solder and your ready to go. Solder balling occurs if the solder paste spatters small explosions during reflow or if the paste slumps and the flux spreads carrying away solder particles which cannot reflow back into the solder mass.

Silk screen are pretty inexpensive these days. The process is focusing on creating acceptable solder joints by pre-heated components which provides the opportunity to melt the solder without causing damage by overheating. Stencil Design Solder Paste Deposition.

The solder paste reflows in a molten state creating permanent solder joints. Reflow soldering is the most popular and widely used method of connecting surface mount technology SMT components to a printed circuit board PCB. There are several sources for how a reflow profile graph should look like.

Solder paste in a syringe. No problem check out basic soldering tutorial and surface mount soldering guides. If playback doesnt begin shortly.

EASY - How to reflow solder a circuit board - YouTube. When uniform heat is applied to the components and circuit board the temporary connections can become permanent solder bonds. And one of the following.